Chiplet cOOling solutions for Low-consumption emBedded pRocessing AI at Nanoscale

Description

Embedded systems face challenges with high-performance processors, including the size of cooling solutions and overall energy efficiency. Chiplet architecture provides a modular approach to microchip design and is considered the next advancement in semiconductor technology. The EIC-funded COOLBRAIN project aims to enhance chiplet architecture for embedded systems and smart devices, with a focus on AI. It endeavours to reduce hotspots through advanced cooling and energy harvesting, using the near-field super-Planckian effect to convert thermal energy into electricity. The project will develop nanoscale diamond technologies for low-temperature applications and create heat spreaders with conformal cavities. By integrating these solutions, it seeks to lower operating temperatures in high-performance computing and recover up to 30 % of thermal energy.

Main Local Researcher

Miguel Ângelo da Costa Neto

Coordination

THALES SA (FR39)

Partners

DIAMFAB; III-V LAB; INSTITUTO DE TELECOMUNICAÇÕES - POLO DE AVEIRO; UNIVERSIDADE DE AVEIRO; UNIVERSITY OF BRISTOL

Sponsors

Sponsors
Share this Project:

Related Projects

We use cookies for marketing activities and to offer you a better experience. By clicking “Accept Cookies” you agree with our cookie policy. Read about how we use cookies by clicking "Privacy and Cookie Policy".