Chiplet cOOling solutions for Low-consumption emBedded pRocessing AI at Nanoscale

Descrição

Embedded systems face challenges with high-performance processors, including the size of cooling solutions and overall energy efficiency. Chiplet architecture provides a modular approach to microchip design and is considered the next advancement in semiconductor technology. The EIC-funded COOLBRAIN project aims to enhance chiplet architecture for embedded systems and smart devices, with a focus on AI. It endeavours to reduce hotspots through advanced cooling and energy harvesting, using the near-field super-Planckian effect to convert thermal energy into electricity. The project will develop nanoscale diamond technologies for low-temperature applications and create heat spreaders with conformal cavities. By integrating these solutions, it seeks to lower operating temperatures in high-performance computing and recover up to 30 % of thermal energy.

Coordenação

THALES SA (FR39)

Participantes

DIAMFAB; III-V LAB; INSTITUTO DE TELECOMUNICAÇÕES - POLO DE AVEIRO; UNIVERSIDADE DE AVEIRO; UNIVERSITY OF BRISTOL

Financiadores

Sponsors
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