Atomic layer deposition of high-kappa layers on polycrystalline diamond for MOS devices: a review

authors	Jaggernauth, A; Mendes, JC; Silva, RF
nationality	International
journal	JOURNAL OF MATERIALS CHEMISTRY C
keywords	BORON-DOPED DIAMOND; OXIDE THIN-FILMS; LOW-TEMPERATURE; NANOCRYSTALLINE DIAMOND; ELECTRICAL-PROPERTIES; SURFACE-ROUGHNESS; IN-SITU; GROWTH-CHARACTERISTICS; DIELECTRIC-CONSTANT; EMISSION PROPERTIES
abstract	Changes in the expected performance of electronic devices have heavily influenced investigation into Si-substitute materials having the ability to meet these demands. Two examples are especially pertinent to the performance of metal oxide semiconductor (MOS) devices. The first is the move towards films with high dielectric constants (high-kappa); as more components are placed onto circuit boards to facilitate the numerous system operations, the size of each device is greatly reduced necessitating exploration into more suitable options for replacing SiO(2)and Al(2)O(3)films in transistors and capacitors to effectively control semiconductor charge carriers and prevent charge leakage. The second is investigation into ultra-wide band gap (UWBG) semiconductor materials to efficiently permit device operation in harsh and extreme conditions, high temperature and high power applications. Polycrystalline diamond (PCD) is an UWBG material that provides a cost effective option for MOS devices, but it has yet to be fully studied for these applications. In addition, the combination of high-kappa films on PCD for MOS components has been limited to Al(2)O(3)despite the ability to fabricate films with higher kappa values by atomic layer deposition (ALD), a technique which imparts advantages of self-limiting and saturation reactions with atomic layer control, resulting in continuous and conformal nano-thin films. It is the aim of this article therefore to highlight pertinent parameters and considerations for the optimization of high-kappa materials, predominantly oxides, by ALD onto diamond film surfaces, specifically for use in MOS devices. It discusses the ALD technique and optimization of its parameters, then presents an understanding of diamond film conductivity, focussed on PCD films. Collating these two areas, it reviews high-kappa film fabrication on diamond, as passivation layers and gate dielectric films. Furthermore, it examines the challenge of surface nucleation in ALD reactions and strategies for its minimization, presenting examples from literature which address this issue on 2D materials. Finally, this work culminates in a review of diamond MOS device performance as reported in literature.
publisher	ROYAL SOC CHEMISTRY
issn	2050-7526
isbn	2050-7534
year published	2020
volume	8
issue	38
beginning page	13127
ending page	13153
digital object identifier (doi)	10.1039/d0tc02063j
web of science category	Materials Science, Multidisciplinary; Physics, Applied
subject category	Materials Science; Physics
unique article identifier	WOS:000578027500001