Ceramic processing strategies for thick films on copper foils


Functional oxides on Cu have multiple applications. For thick films the required high sintering temperatures present a challenge for processing on base metal substrates. In this study it is shown that it is possible to adapt well-known ceramic processing strategies to the fabrication of thick lead zirconate titanate (PZT) films on Cu with useful ferroelectric properties. PZT powders with optimized particle sizes are used to fabricate thick films by electrophoretic deposition in combination with a post-deposition isostatic pressing step. This approach to maximize green packing is sufficient to dramatically lower the required sintering temperatures. 25 mu m thick PZT films on Cu sintered at 900 degrees C have a dielectric permittivity of 585, a loss tangent at 10 kHz of 0.03, a remanent polarization of 19 mu C cm(-2) and a coercive field of 22 kV cm(-1). This significant improvement in the dielectric response opens the possibility of using thick PZT films on Cu for a wide range of devices where cost, yield and reliability are concerns. (C) 2009 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved.



subject category

Materials Science; Metallurgy & Metallurgical Engineering


Wu, AY; Vilarinho, PM; Kingon, AI

our authors


The authors acknowledge the financial support from FEDER, FCT, POCI 2010, CICECO, and FAME Network, under contract FP6-500159-1. Daniel J. Lichtenwalner, North Carolina State University is acknowledged for his assistance with some ferroelectric measurements.

Share this project:

Related Publications

We use cookies for marketing activities and to offer you a better experience. By clicking “Accept Cookies” you agree with our cookie policy. Read about how we use cookies by clicking "Privacy and Cookie Policy".